北京·中关村集成电路设计园建筑设计/墨臣建筑设计

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

中关村集成电路设计园旨在创建IC产业生态综合创新产业园区。业主希望产业园区能够使其成为吸引全球集成电路资源的世界级专业园区,从而打造出一个全生命周期的园区环境。此外,应在园区内营造一种人文氛围,来迎合高科技创新主力军交流的场所。

Text description provided by the architects. The birth of the IC PARK benefits from the national integrated circuit development strategy, which aims to build an integrated innovation industrial park of IC industry ecology. The owners expect the industrial park to be built in such a way that it will become a world-class professional park attracting global integrated circuit resources, to create a park environment with a full life cycle. In addition, a humanistic atmosphere should be created in the park with an image that is suitable for the interchange of the main forces of hi-tech innovation. 

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

设计分析

该项目位于中关村国家自主创新示范区的中心位置。在中央处,将保留一条60米宽,800米长的城市绿化带。在尊重城市设计导则外,项目还需考虑以下三个特点:大尺度开放空间,轴线对称的规划布局,中高边低的天际线。

此外,为创造适用于高科技创新主力军的交流场所,设计者提出采用“多维互动”的新型空间模式,使园区的交流环境分出层级和属性,从而呈现出一个既互动又不干扰的立体空间。

The project is located at the center of The Zhongguancun National Demonstration Zone. In the center of the project area, a 60 m wide and 800 m long urban greenbelt will be reserved. In addition to fully respecting the guidelines for urban design, the project design also needs to take into account the following three characteristics: large-scale open space, symmetrical axis planning layout, high in the middle and low on both sides of the skyline. Besides, to create communication places for hi-tech innovative main force, the designer finally proposed to adopt a new spatial model of “multi-dimensional interaction,” which allows the communication environment of the park to be divided into levels and attributes, so that it can present a three-dimensional space that is interactive and undisturbed.

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

总体规划

项目整体布局采用一心、二园、三轴、三广场的规划布局特点。高层办公区将位于园区的中心位置,而花园式的单栋办公将位于高层的两侧。园区商业配套主要集中与高层底层相连的核心云台区域。

The overall layout of the project adopts the planning layout characteristics of one center, two park zones, three axes and three squares. The high-rise office zone will be located in the central position of the park zones, while the garden-style single-family office zone will be located on both sides of the high-rise, which will be built as a group independently. The Business District of the park zone is mainly located in the core cloud terrace zone connected to the bottom of the high-rise building.

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

一心:凝聚核心场所

连接两侧高层建筑之间的一层架空走廊、屋顶花园和下沉广场,形成IC设计园的核心场所。云台区中还设有图书馆,文化活动中心,咖啡厅等场所,提供各种社交功能配套设施。云台上的屋顶花园可布置成健身跑道、休闲区、智能互动区等功能,使整个屋顶花园的运动线条更加自由、动感。下沉庭院位于云台下面。该区域以宜人的小尺度设计出丰富的庭院布局。

Connecting the first-floor overhead corridor, roof garden and sinking square between two high-rise buildings, the core place of an IC design park forms. Libraries, cultural activity centers, cafes and other places are also arranged in the cloud platform zone, to provide the various social function supporting facilities. The roof garden area on the cloud platform can be arranged into fitness runway, leisure zone, intelligent interactive zone and so on, which makes the movement lines of the whole roof garden freer and more dynamic. The sinking courtyard is situated below the cloud platform. This zone is designed with the pleasant small-scale and rich courtyard layout.

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

二园:办公需求多元化

结合园区内50m宽的绿化带,设计了两组以中型企业为主的具有围合感的小型办公区。

Combined with the 50m wide greenbelt inside the park, two groups of small office zones with a sense of enclosure are designed, which are mainly for medium-sized enterprises.

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

三轴:构思城市之脉

项目利用架空层形成贯穿整个园区的三条轴线,同时串联起来园区的主要空间。

It adopts the overhead layer to form three axes running through the whole park, which connects the main spaces of the park in series.

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

城市轴线:60米宽的绿化带轴线作为大尺度的开放空间。

视线通廊:贯穿园区主功能线,引导交通。

园区绿轴:连接东西单栋办公区的桥梁。

City Axis: The 60 m wide greenbelt axis is designed as a large-scale open space.

Visual corridor: It runs through the main function line of the park, guiding the traffic.
Greenbelt Axis of the Park: This axis is a bridge connecting the East and West single-family office zones.

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

三广场:完善功能区

创业广场,作为园区的精神堡垒;

创客公园,作为园区的活力核心区,由云平台和活力之谷打造;

创新空间,作为园区后花园。

The Startup Square, as the spiritual fortress of the park zones;

The Makers Park, as the park vigorous core zone, consisting of the Cloud Platform and Vigorous Valley;
The Innovation Space, as the Backyard of the park.

总平面图
北京·中关村集成电路设计园建筑设计/墨臣建筑设计
建筑设计

外墙设计引入了“芯片”的工艺美感,同时采用透射率较高的玻璃幕墙体系局部点缀米色石材,还通过错拼手法体现出IC产业的科技感,架空裙房部分通过连续的水平线条体现出漂浮感。

The technology aesthetics of “chip”should be introduced into the facade design. Besides, the glass curtain wall system with higher transmittance should be adopted , and partially the beige stone be embellished. In addition, it is also necessary to highlight the sense of science and technology in the IC industry through tiling row upon row of materials, thus the continuous horizontal lines of an overhead podium showing a scene of floating through.

平面图
北京·中关村集成电路设计园建筑设计/墨臣建筑设计

绿色设计

在生态环境方面,项目整体设计以人为本,充分尊重自然环境。此外,还考虑了可持续发展设计要求,从节能,节水,节约土地,节约材料等进行设计。目前,该园区已获得绿色建筑两星,三星认证及“ LEED CS”金级认证。

In terms of ecological environment, the overall design of the project is people-oriented, which fully respects the natural environment. In addition, sustainable development is also taken into account in the design. It is carefully designed from the aspects of energy-saving, water-saving, land-saving and materials-saving. At present, the park has already been awarded with the Green Building Two-Star, Three-Star and “LEED CS” Gold Certifications.

立面图
北京·中关村集成电路设计园建筑设计/墨臣建筑设计

扎根城市,定位轴心,技术汇集,互联共享,绿色低碳,IC产业园区正以成熟的姿态走向世界,被世界认可。

With the characteristics of: rooted in the city, located axis, technology collection, interconnection and sharing, green and low-carbon, the IC Park is being gazed by the world with a mature attitude.

立面图
北京·中关村集成电路设计园建筑设计/墨臣建筑设计

剖面图
北京·中关村集成电路设计园建筑设计/墨臣建筑设计

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

流线图
北京·中关村集成电路设计园建筑设计/墨臣建筑设计

示意图
北京·中关村集成电路设计园建筑设计/墨臣建筑设计

北京·中关村集成电路设计园建筑设计/墨臣建筑设计

建筑师:北京墨臣建筑设计事务所
地点:北京
主建筑师:许晓冬
设计团队:程章、张爽、王专等
面积:217300.0平方米
年份:2018年

©版权声明

本文来源于 墨臣建筑设计查看链接。文章内相关信息的知识产权归其权利人所有,特来设计对其不享有任何知识产权,仅做学习交流之目的。若本文存在任何知识产权争议,请相关权利方及时通知特来设计,以便特来设计迅速采取适当措施(删除、澄清声明等形式),以避免给双方造成不必要损失。

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